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High-gloss Polish with Sealant. Innovative machine polish for quickly producing high-gloss surfaces and for effectively removing scratches and grindings from a grit size of P2000 and above with a simultaneous sealing effect.
Koch Chemie Rkr - STRONG - effectively removes deposits such as tree resin, insects, industrial dust, and tar. Optimal for intensive cleaning before the polishing process or before fitting new windscreen wipers. Not recommended for new paintwork because subsequent polishing is necessary.
Removes even stubborn deposits such as tree resin and insects, rust bloom, brake dust, spray mist, tar, limescale stains, and etc gently from smooth surfaces such as paintwork and glass, without affecting or damaging them. Optimal for intensive cleaning before the polishing process or before...
Strong polishing compound that efficiently removes paint mists and sanding traces. Free from silicone, making it safer and more compatible with various surfaces. Designed for easy and quick removal of blemishes from a grit level of 1,200 and higher. Special composition guarantees easy...
Fine polishing compound, silicone-oil-free I ntelligent machine polish of the latest generation with unique aluminium oxide quality. The intelligent grain size ensures very quick, complete removal of wash system scratches and similar traces of use and gives the paintwork a long-lasting deep sheen.
H9.02 Heavy Cut is a heavy cutting compound ideal for the removal of heavy marring, elimination of deep scratches, effective removal of paint mists and sanding traces of up to 1,200 grain. With its abrasive grain, Heavy Cut 9.02 achieves an extremely high level of cut with an excellent gloss...
Micro Cut & Finish is the latest generation machine micro-polish for the permanent removal of streaks, holograms, fine scratches and sanding marks to P3000 grain size on all paint systems (including scratch-resistant) with simultaneous long-term sealing with high degree of gloss and...
Micro polishing compound, silicone-oil-free. Micro Cut M3.02 is the latest generation machine micro-polish for the permanent removal of streaks, holograms, fine scratches and sanding marks to P3000 grain size on all paint systems (including scratch-resistant).
Extra-fine finish sponge for economically and evenly applying sealing products such as the 1K Nano or Lack-Polish grün P1.01. The short height of 23mm creates low torsion forces, excellent handling and the highest level of stability. The optimised reticulation (open cellular structure) and cell...
Abrasive sponge for removing strong weathering and deep scratches using the Heavy Cut H9.01. The short height of 23mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long-lasting compression hardness during...
Medium abrasive sponge for removing moderate weathering and scratches using the One Cut and Finish P6.01. The short height of 23mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long-lasting compression hardness...
Koch-Chemie's Fine Cut Pad is a medium abrasive sponge for removing moderate weathering and scratches using Koch-Chemie's Fine Cut F6.01 Polishing Compound. The short height of 23mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam...
Koch-Chemie's Micro Cut Pad is a high-quality special sponge for removing fine scratches, holograms and polishing marks using Koch-Chemie's Micro Cut M3.02 and/or Micro Cut & Finish P3.01 Polishing Compounds. The short height of 23mm creates low torsion forces, very good handling and the...
