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H9.02 Heavy Cut is a heavy cutting compound ideal for the removal of heavy marring, elimination of deep scratches, effective removal of paint mists and sanding traces of up to 1,200 grain. With its abrasive grain, Heavy Cut 9.02 achieves an extremely high level of cut with an excellent gloss...
Micro Cut & Finish is the latest generation machine micro-polish for the permanent removal of streaks, holograms, fine scratches and sanding marks to P3000 grain size on all paint systems (including scratch-resistant) with simultaneous long-term sealing with high degree of gloss and...
Micro polishing compound, silicone-oil-free. Micro Cut M3.02 is the latest generation machine micro-polish for the permanent removal of streaks, holograms, fine scratches and sanding marks to P3000 grain size on all paint systems (including scratch-resistant).
Extra-fine finish sponge for economically and evenly applying sealing products such as the 1K Nano or Lack-Polish grün P1.01. The short height of 23mm creates low torsion forces, excellent handling and the highest level of stability. The optimised reticulation (open cellular structure) and cell...
Abrasive sponge for removing strong weathering and deep scratches using the Heavy Cut H9.01. The short height of 23mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long-lasting compression hardness during...
Medium abrasive sponge for removing moderate weathering and scratches using the One Cut and Finish P6.01. The short height of 23mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam material enables long-lasting compression hardness...
Koch-Chemie's Fine Cut Pad is a medium abrasive sponge for removing moderate weathering and scratches using Koch-Chemie's Fine Cut F6.01 Polishing Compound. The short height of 23mm creates low torsion forces, very good handling and the highest level of stability. The special density of the foam...
Koch-Chemie's Micro Cut Pad is a high-quality special sponge for removing fine scratches, holograms and polishing marks using Koch-Chemie's Micro Cut M3.02 and/or Micro Cut & Finish P3.01 Polishing Compounds. The short height of 23mm creates low torsion forces, very good handling and the...
